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| Panasonic
HT122/123 |
HIGH
SPEED PLACEMENT MACHINE
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Realization
of excellent productivity and placement quality
enabling high speed placement at a maximum speed
of 0.066 s/chip(54 500 cph), 0603（0201）narrow spacing
placement, and CSP all-ball detection placement. |
| Model
name |
HT122
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HT132
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Model
No.
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NM-HE30 |
NM-HE31 |
NM-HE32 |
NM-HE35 |
NM-HE36 |
NM-HE37 |
| PCB
dimensions |
L
50 mm × W 50 mm to L 330 mm × W 250 mm |
L
50 mm × W 50 mm to L 510 mm × W 460 mm |
| Max.speed |
0.066
s/chip（depends on component type） |
| Placement
accuracy |
50
μm/3 σ |
| No.of
component inputs *1 |
75+75(150+150) |
50+50(100+100) |
30+30(60+60) |
75+75(150+150) |
50+50(100+100) |
30+30(60+60) |
| component
dimensions |
0603
chip to L 24 mm × W 24 mm, QFP, BGA, CSP |
| PCB
exchange time *2 |
2.0
s |
2.5
s |
| Electric
source *3 |
3-phase
AC 200 V, 9.5 kVA |
| Pneumatic
source |
0.5
MPa, 220 L/min（A.N.R.） |
| Dimensions(W) |
7
100 mm |
4
950 mm |
3
230 mm |
7
100 mm |
4
950 mm |
3
230 mm |
| Dimensions(D×H) |
D
1 900 mm × H 1 800 mm *4 |
D
2 110 mm × H 1 800 mm *4 |
| Mass
*5 |
4
800 kg |
4
600 kg |
4
100 kg |
5
150 kg |
4
950 kg |
4
450 kg |
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Values
such as Max.speed and placement accuracy may vary
depending on operating conditions.
Please refer to the specifications on details. |
*1:
When using 8 mm, 12 mm tape feeder,Inside of ()
double tape feeder.
*2: Depend on the board dimensions.
*3: Compatible with 220/380/400/420/480V |
*4:
Excluding signal tower
*5: Excluding tape feeder |
| Further
evolution of accurate component placement from microchips
to BGAs and CSPs. |
- The
rigid, low-vibration die-cast frame and weight
reduction of placement head, and vibration reduction
of the rotary head and X-Y table allow a placement
accuracy of 50 μm/3 σ.
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Switching of placement blow timing with every
placement speed and nozzle ensures placement
under optimum conditions and improves placement
quality.
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Control of component placement height with high-accuracy
line sensor allows high-quality placement.
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Recognition camera with small and large field
of view, reflective and transmissive component
recognition as well as coaxial reflective lighting
provide high-accuracy recognition and placement
of components from 0603（0201）microchips to 24（L）
× 24（W） mm QFPs.
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Rotary
head
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New
model light placement head
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Rigid
die-cast frame
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| Compatible
with high productivity |
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- 18
placement heads（6 nozzles）allow maximum
- placement
speed of 0.066 s/chip（54 500 cph）Increased speed
of the X-Y table realizes high productivity.
- Using
the top tape batch removal cap at the tape feeder
shortens component exchange time.
- Double
tape feeder allows loading of up to 300 different
components.
- IPC*
enables component recognition automation and
reduction of equipment stoppage loss.
- Rotary
Magnet （RM）system bulk feeder* allows.
- high-speed
aligned reliable feeding and long-term uninterrupted
operation
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*
Option |
| Improvement
of productivity |
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- Touch
panel allows easy operation.
- Cutting
down the number of recognition algorithm component
assortments to seven groups, that do all the
100 kinds of jobs as before, allows easy assortment
selection.
- Convenient,
complete library creation method.
- Wizard system based on database search and
diagrams.
- Automatic instruction method that teaches
and conveys
- component data.
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沪ICP备031972
超高速转塔系列
